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Electronics

In the modern electronic packaging materials industry, silica powder and LTCC glass powder are core raw materials. After being processed to the micron or even nanometer scale through ultrafine grinding, they have found increasingly widespread application in the copper clad laminate (CCL) manufacturing industry due to their excellent properties such as acid and alkali corrosion resistance, high insulation, and high thermal conductivity.

Ultrafine grinding enhances the specific surface area and dispersibility of the raw materials. Combined with the optimization of surface treatment processes, their interfacial compatibility with resin systems has been significantly improved. As fillers, they not only help control the production costs of CCLs but also precisely optimize key properties such as the coefficient of thermal expansion (CTE) and enhance flexural strength, thereby highlighting their functional value.

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for the following raw materials

We can provide equipment that

meets these process requirements

Precise & Uniform Particle Size​

The electronics industry has strict requirements for powder particle size. Ultra-fine crushing and classification technology can accurately crush materials to the micron level via vertical turbo classifiers and frequency conversion speed regulation. The classification system strictly controls large particles and avoids over-crushing, stably producing powders with concentrated particle sizes to meet the core demand for particle size consistency in electronic components and ensure stable product performance.

Enhanced Performance & Optimized Application

After ultra-fine crushing, the powder’s specific surface area increases significantly, improving the adsorption, solubility and reaction activity of electronic materials. In battery materials, it enhances the contact efficiency between electrodes and electrolytes and boosts energy density; in ceramic pigments, it improves coloring uniformity, optimizing the performance and appearance of electronic devices.

Pure Pollution-Free Processing

The equipment features a fully sealed structure, with the main body made of clean materials like stainless steel. Some models are equipped with independent air source purification modules. The crushing process is completed in a closed system, isolating air dust pollution and avoiding impurities from equipment wear. Pure physical processing without chemical additives ensures the high purity of electronic-grade powders.

Simultaneous Multi-Particle & High Efficiency

A single device can be equipped with multiple classifiers to form a 2-5 unit configuration, enabling simultaneous production of finished products with multiple particle sizes in one processing cycle. No repeated processing is needed, greatly shortening the production cycle of electronic materials, reducing material loss, and improving production efficiency and resource utilization.

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